DocumentCode
1581784
Title
Crystal Growth of 3C-SiC Thin-Films on Si Wafers for Microsensors of Vehicle Engines
Author
Kim, Kang-San ; Chung, Gwiy-Sang
Author_Institution
Sch. of Electr. Eng., Ulsan Univ.
fYear
2006
Firstpage
279
Lastpage
282
Abstract
This paper presents the growth conditions and characteristics of polycrystalline 3C-SiC thin-films for microsensors related to vehicle engine fields. The growth of the poly 3C-SiC thin-films on the oxided Si (100) wafers was been carried out by APCVD using HMDS precursor. To obtain an optimized growth condition, we have performed depositions under various conditions that temperature was adjusted from 1000 degC to 1200 degC, HMDS flow rates was changed from 5 to 9 sccm, and carrier gas (Ar) was kept up 500 seem. Each samples were analyzed by XRD (X-ray diffraction), XPS (X-ray photoelectron spectroscopy), and FT-IR (Fourier transform-infrared spectroscopy) to find the optimized growth condition. Also, layer density, voids, and dislocations of the cross-section were measured by SEM (scanning electron microscope). From the results of experiment, we have obtained that temperature and HMDS flow rates of the optimized poly 3C-SiC thin-film growth condition were 1000 degC and 8 sccm, respectively.
Keywords
Fourier transform spectroscopy; X-ray diffraction; X-ray photoelectron spectra; crystal growth; engines; microsensors; scanning electron microscopy; semiconductor thin films; silicon compounds; vehicles; wide band gap semiconductors; 1000 to 1200 degC; FT-IR; Fourier transform-infrared spectroscopy; SEM; SiC; X-ray diffraction; X-ray photoelectron spectroscopy; XPS; XRD; carrier gas; microsensors; scanning electron microscope; thin-film crystal growth condition; vehicle engine microprocessors; Argon; Engines; Microsensors; Scanning electron microscopy; Semiconductor thin films; Spectroscopy; Temperature; Thin films; Vehicles; X-ray scattering;
fLanguage
English
Publisher
ieee
Conference_Titel
Strategic Technology, The 1st International Forum on
Conference_Location
Ulsan
Print_ISBN
1-4244-0426-6
Electronic_ISBN
1-4244-0427-4
Type
conf
DOI
10.1109/IFOST.2006.312307
Filename
4107379
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