Title :
Analysis of structural mechanics of solid microneedle using COMSOL software
Author :
Kanakaraj, Urvi ; Lhaden, Tshewang ; Karthik Raj, V.
Author_Institution :
Dept. of Biomed. Eng., SRM Univ., Chennai, India
Abstract :
Microneedles are currently being extensively researched for therapeutic and diagnostic applications, as they are painless, cheaper than conventional needles, and reduce risk of infection. In this paper, we have selected 10 materials for solid microneedle and have performed the structural analysis of each material using COMSOL Multiphysics 4.3. The study was based on the factors affecting microneedle strength such as buckling and bending forces. The result indicated that the microneedle made of Silicon carbide was superior to the other selected materials and while considering the property of biodegradability for the same study, Silk was preferred. PLA and Polycarbonate experienced buckling and thus were not preferred from the selected materials.
Keywords :
bending; bioMEMS; biodegradable materials; buckling; materials science computing; needles; silicon compounds; COMSOL Multiphysics 4.3 software; PLA; SiC; bending forces; biodegradability; buckling; diagnostic applications; microneedle strength; polycarbonate; silicon carbide; silk; solid microneedle; structural analysis; therapeutic applications; Drugs; Force; Needles; Programmable logic arrays; Silicon carbide; Skin; Stress; COMSOL Multiphysics 4.3; Silicon Carbide; Solid Microneedle; bending; buckling;
Conference_Titel :
Innovations in Information, Embedded and Communication Systems (ICIIECS), 2015 International Conference on
Conference_Location :
Coimbatore
Print_ISBN :
978-1-4799-6817-6
DOI :
10.1109/ICIIECS.2015.7193243
