MEMS for practical application with attention to packaging

Author

Esashi, M.

Author_Institution

Dept. of Nanomech., Tohoku Univ., Sendai

fYear

2006

Firstpage

1

Lastpage

4

Abstract

MEMS (micro electro mechanical systems) has been studied for practical applications with attention to packaging. Wafer level packaged devices as integrated capacitive pressure sensor, MEMS relay and electrostatically levitated rotational gyroscope and arrayed MEMS as multi-probe data storage and multi-column electron beam lithography system have been developed. Electrical feedthroughs in glass play important roles in the wafer level packaging and the arrayed MEMS. Materials as diamond for recording probe and carbon nano tube for electron field emitter are utilized in the MEMS for their functionalities

Keywords

carbon nanotubes; electron beam lithography; gyroscopes; micromechanical devices; pressure sensors; wafer level packaging; MEMS relay; arrayed MEMS; carbon nano tube; electrical feedthroughs; electron field emitter; electrostatically levitated rotational gyroscope; integrated capacitive pressure sensor; micro electro mechanical systems; multicolumn electron beam lithography; multiprobe data storage; packaging; wafer level packaged devices; wafer level packaging; Capacitive sensors; Gyroscopes; Mechanical sensors; Mechanical systems; Micromechanical devices; Packaging; Relays; Sensor arrays; Sensor systems; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International

Conference_Location

Taipei

Print_ISBN

1-4244-0735-4

Electronic_ISBN

1-4244-0735-4

Type

conf

DOI

10.1109/IMPACT.2006.312180

Filename

4107437