DocumentCode :
1583786
Title :
A Study of High Sensitive Diaphragm for Silicon Microphone Applications
Author :
Ray-Hua Horng ; Lin, Zong-Ying ; Jiang, Yu-Ning ; You, Shang-Hua ; Zhun, Shu-Zhen ; Wang, Ru-Guan ; Chang, Shao-Chih ; Tsai, Tsun-I ; Lai, Chung-Chi ; Chen, Chi-Liang
Author_Institution :
Inst. of Precision Eng., Nat. Chung-Hsing Univ., Taichung
fYear :
2006
Firstpage :
1
Lastpage :
4
Abstract :
This paper presents the design and analysis of high sensitive diaphragm for electret microphone applications. In general, the sensitivity of electret microphone depends on the electrical sensitivity and the mechanical sensitivity of the diaphragm. The high mechanical sensitivity can be determined by the mechanical properties of the diaphragm. In order to obtain high sensitive microphones, the properties of low tensile stress and larger area of the diaphragms were fabricated. In this study, the spacer and the thickness of the backplate of electret microphone are 16 mum and 120 mum, respectively. The diaphragm made of polyimide and Si3N4 materials with various thickness and area were evaluated. It was found that the diaphragm made of polyimide presents the better sensitivity as compared with that made of Si3N4 materials. On the other hand, the larger area of diaphragm results in the higher sensitivity of the microphone. The corresponding sensitivity is 9 mV/Pa in the frequency range of 50 Hz to 12 kHz under the electret material with -120 V
Keywords :
diaphragms; electrets; micromechanical devices; microphones; sensitivity analysis; silicon compounds; tensile strength; -120 V; 120 mum; 16 mum; 50 Hz to 12 kHz; Si3N4; electret microphone applications; electrical sensitivity; high sensitive diaphragm; mechanical sensitivity; mechanical strength; polyimide; silicon microphone applications; tensile stress; Consumer electronics; Costs; Electrets; Etching; Fabrication; Internal stresses; Microphones; Polyimides; Silicon; Tensile stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
Conference_Location :
Taipei
Print_ISBN :
1-4244-0735-4
Electronic_ISBN :
1-4244-0735-4
Type :
conf
DOI :
10.1109/IMPACT.2006.312194
Filename :
4107451
Link To Document :
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