• DocumentCode
    1583825
  • Title

    The development of a high performance, low cost package for MEMS Microphone package by using Lead-frame Land Grid Array (LLGA)

  • Author

    Tien, Jiung-Yue ; Yung, His-Chen ; Tu, Min-Te ; Huang, Chin-Ching

  • Author_Institution
    TEPZ, Taichung
  • fYear
    2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A new MEMS microphone package have been developed. A new technical process of LGA is utilized to meet the light, thin, short, small and high performance package. The developed leadframe based MEMS microphone can adopt SMD process, which can be applied to automatic cell phone microphone assembly process, and reduce 20% of the production cost
  • Keywords
    electronics packaging; microassembling; micromechanical devices; microphones; mobile handsets; LLGA; MEMS microphone package; SMD process; automatic cell phone microphone assembly process; lead-frame land grid array; low cost package; Assembly; Cellular phones; Conducting materials; Costs; Electromagnetic fields; Micromechanical devices; Microphone arrays; Packaging; Sheet materials; Transfer functions; Lead-frame; MEMS Microphone; SMD; low cost;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
  • Conference_Location
    Taipei
  • Print_ISBN
    1-4244-0735-4
  • Electronic_ISBN
    1-4244-0735-4
  • Type

    conf

  • DOI
    10.1109/IMPACT.2006.312197
  • Filename
    4107454
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1583825