Solder joints reliability of leaded surface mounted components-a requirement for new quality insurance procedures

Author

Saint-Martin, X. ; Joly, J.

Author_Institution

BULL SA, Les Clayes-Sous-Bois, France

fYear

1988

Firstpage

100

Lastpage

105

Abstract

The objective of this work is to analyze stresses induced in the solder joint and to minimize the risk of crack initiation at the solder-joint level. Thermomechanical analysis of solder joints and thermomechanical simulation have helped the authors to optimize the process, to give recommendations for solder-joint inspection, and to put in place new quality insurance procedures that take into account the thermomechanical parameters of components and mounting processes. Experimental results support these first simulation results. Recommendations and proposals for new quality insurance procedures are presented.<>

Keywords

circuit reliability; quality control; soldering; surface mount technology; crack initiation; leaded surface mounted components; mounting processes; quality insurance procedures; solder joint; thermomechanical parameters; thermomechanical simulation; Analytical models; Inspection; Insurance; Lead; Proposals; Risk analysis; Soldering; Surface cracks; Thermal stresses; Thermomechanical processes;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International

Conference_Location

Lake Buena Vista, FL, USA

Type

conf

DOI

10.1109/EMTS.1988.16158

Filename

16158