Sticking Effect on Cantilever Beam with Wetting Length of Liquid Less Than Beam Length after Spinning Drying

During wet etching of micromachining, the cantilever beam is often attached to the underlying substrate due to the capillary force even the wafer being spin dry. The effect of rinse length and position of liquid on sticking phenomena is discussed is this work. Two critical gaps to determine the cantilever beam being sticking or not are derived. The results show the beam is a little more easily attached to the substrate as the position of liquid farther from the fixed end. However, it is not significant. And the longer wetting length will let the beam more easily sticking