Title :
Surface micromachined platforms using electroplated sacrificial layers
Author :
Kim, Y.W. ; Allen, M.G.
Author_Institution :
Sch. of Electr. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
A technique for the surface micromachining of structures suspended many tens of microns above a substrate surface is presented. Electroplated metal sacrificial layers are used in a standard surface micromachining process to achieve the necessary sacrificial layer thickness. The process is demonstrated using copper as the sacrificial layer and polyimide as the structural material. Surface micromachined bridges 8 mu m thick, 160 mu m long, and 100 mu m wide suspended over the surface from 10 to 50 mu m have been fabricated in this manner. In addition, movable platforms suspended 15 mu m above a surface over an area of 3*3 mm have also been demonstrated.<>
Keywords :
copper; electroplated coatings; etching; integrated circuit technology; Cu sacrificial layer; bridge structure; electroplated sacrificial layers; microbridge; movable platforms; polyimide; surface micromachining; Bridges; Chemical vapor deposition; Copper; Etching; Fabrication; Micromachining; Microstructure; Planarization; Polyimides; Testing;
Conference_Titel :
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-87942-585-7
DOI :
10.1109/SENSOR.1991.148964
