DocumentCode
1584074
Title
Towards optical networks-on-chip with 200mm hybrid technology
Author
Fedeli, J. -M ; Liu, L. ; Grenouillet, L. ; Bordel, D. ; Mandorlo, F. ; Olivier, N. ; Spuesens, T. ; Régreny, P. ; Grosse, P. ; Rojo-Romeo, P. ; Orobtchouk, R. ; Van Thourhout, D.
Author_Institution
LETI, CEA, Grenoble, France
fYear
2011
Firstpage
1
Lastpage
3
Abstract
Integrated components for optical networks-on-chip, including III-V microdisk lasers, photodetectors, and wavelength selective circuits, are all demonstrated using a complementary metal-oxide-semiconductor (CMOS) compatible III-V/silicon-oninsulator integration technology at 200mm wafer scale.
Keywords
CMOS integrated circuits; III-V semiconductors; network-on-chip; optical communication; silicon-on-insulator; CMOS; III-V microdisk laser; complementary metal-oxide-semiconductor; hybrid technology; optical networks-on-chip; photodetectors; silicon-on-insulator integration technology; size 200 mm; wavelength selective circuit; Bonding; CMOS integrated circuits; Indium phosphide; Optical interconnections; Optical waveguides; Silicon; Waveguide lasers; heterogeneous integration; microdisk lasers and photodetectors; network-on-chip; silicon photonics;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communication Conference and Exposition (OFC/NFOEC), 2011 and the National Fiber Optic Engineers Conference
Conference_Location
Los Angeles, CA
ISSN
pending
Print_ISBN
978-1-4577-0213-6
Type
conf
Filename
5875304
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