Title :
Towards optical networks-on-chip with 200mm hybrid technology
Author :
Fedeli, J. -M ; Liu, L. ; Grenouillet, L. ; Bordel, D. ; Mandorlo, F. ; Olivier, N. ; Spuesens, T. ; Régreny, P. ; Grosse, P. ; Rojo-Romeo, P. ; Orobtchouk, R. ; Van Thourhout, D.
Author_Institution :
LETI, CEA, Grenoble, France
Abstract :
Integrated components for optical networks-on-chip, including III-V microdisk lasers, photodetectors, and wavelength selective circuits, are all demonstrated using a complementary metal-oxide-semiconductor (CMOS) compatible III-V/silicon-oninsulator integration technology at 200mm wafer scale.
Keywords :
CMOS integrated circuits; III-V semiconductors; network-on-chip; optical communication; silicon-on-insulator; CMOS; III-V microdisk laser; complementary metal-oxide-semiconductor; hybrid technology; optical networks-on-chip; photodetectors; silicon-on-insulator integration technology; size 200 mm; wavelength selective circuit; Bonding; CMOS integrated circuits; Indium phosphide; Optical interconnections; Optical waveguides; Silicon; Waveguide lasers; heterogeneous integration; microdisk lasers and photodetectors; network-on-chip; silicon photonics;
Conference_Titel :
Optical Fiber Communication Conference and Exposition (OFC/NFOEC), 2011 and the National Fiber Optic Engineers Conference
Conference_Location :
Los Angeles, CA
Print_ISBN :
978-1-4577-0213-6
