Process-dependent Thermal-mechanical Analysis and Design of a Novel Nanowire-based Anisotropic Conductive Film Assembly

The process-induced thermal-mechanical behaviors of the ^np ACF typed FC technology during bonding process and temperature variation are investigated. For achieving the goal, a process-dependent simulation methodology is introduced, which incorporates a transient thermal and static thermal-mechanical finite element (FE) modeling and a "death-birth" meshing scheme. Prior to the modeling, the mechanical properties of the ^npACF film are first characterized through both the rule-of-mixture technique and the proposed FE-based scheme. Moreover, the validity of the proposed transient thermal modeling is also verified by way of a micro thermocouple technique for temperature measurement. Finally, parametric FE study is performed to assess the dependence of the thermal-mechanical behaviors of the substrate and the contact stress at the I/O interconnects and the peeling stress at the nonconductive paste (NCP) on a number of geometry and material design parameters