Title :
C4NP - IBM Manufacturing & Reliability Data for Lead Free Flip Chip Solder Bumping
Author :
Ruhmer, Klaus ; Laine, Eric ; Gruber, Peter
Author_Institution :
SUSS MicroTec Inc., Waterbury, VT
Abstract :
C4NP (C4-New Process) is a novel solder bumping technology developed by IBM and commercialized by Suss MicroTec. C4NP addresses the limitations of existing bumping technologies by enabling low-cost, fine pitch bumping using a variety of lead-free solder alloys. C4NP is a solder transfer technology where molten solder is injected into pre-fabricated and reusable glass templates (molds). The filled mold is inspected prior to solder transfer to the wafer to ensure high final yields. The filled mold and wafer are brought into close proximity and solder bumps are transferred onto the entire 300 mm (or smaller) wafer in a single process step without the complexities associated with liquid flux
Keywords :
chip scale packaging; flip-chip devices; liquid alloys; liquid metals; reliability; solders; wafer level packaging; C4-New Process; C4NP; IBM manufacturing; fine pitch bumping; lead free flip chip solder bumping; lead-free solder alloys; molds; molten solder; reliability data; reusable glass templates; solder transfer technology; Costs; Environmentally friendly manufacturing techniques; Flip chip; Glass; Head; Lead compounds; Packaging; Printing; Production; Reservoirs;
Conference_Titel :
Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
Conference_Location :
Taipei
Print_ISBN :
1-4244-0735-4
Electronic_ISBN :
1-4244-0735-4
DOI :
10.1109/IMPACT.2006.312172
