• DocumentCode
    1584331
  • Title

    Materials Challenges and Solutions for the Packaging of High Power LEDs

  • Author

    Lin, Yuan-Chang ; Tran, Nguyen ; Zhou, Yan ; He, Yongzhi ; Shi, Frank G.

  • Author_Institution
    Lab. of Optoelectron. Packaging & Mater., California Univ., Irvine, CA
  • fYear
    2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    As a future lighting source, high power LED lighting is significant in that it provides decades of lifetime under normal operation, requiring a fraction of the power demanded for traditional lighting solutions. For LED lighting to be a viable lighting source, there are many technical challenges to be resolved. Among them the light extraction efficiency, the chip overheating, and the light output degradation are the key issues, which turn out to be all related to the packaging materials. This talk outlines those challenges and reports some of the recent progresses in resolving the key problems
  • Keywords
    electronics packaging; light emitting diodes; chip overheating; high power LED packaging; light extraction efficiency; light output degradation; materials challenges; packaging materials; viable lighting source; Conducting materials; LED lamps; Light emitting diodes; Packaging; Refractive index; Temperature; Thermal degradation; Thermal management; Thermal resistance; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
  • Conference_Location
    Taipei
  • Print_ISBN
    1-4244-0735-4
  • Electronic_ISBN
    1-4244-0735-4
  • Type

    conf

  • DOI
    10.1109/IMPACT.2006.312173
  • Filename
    4107475