Title :
Materials Challenges and Solutions for the Packaging of High Power LEDs
Author :
Lin, Yuan-Chang ; Tran, Nguyen ; Zhou, Yan ; He, Yongzhi ; Shi, Frank G.
Author_Institution :
Lab. of Optoelectron. Packaging & Mater., California Univ., Irvine, CA
Abstract :
As a future lighting source, high power LED lighting is significant in that it provides decades of lifetime under normal operation, requiring a fraction of the power demanded for traditional lighting solutions. For LED lighting to be a viable lighting source, there are many technical challenges to be resolved. Among them the light extraction efficiency, the chip overheating, and the light output degradation are the key issues, which turn out to be all related to the packaging materials. This talk outlines those challenges and reports some of the recent progresses in resolving the key problems
Keywords :
electronics packaging; light emitting diodes; chip overheating; high power LED packaging; light extraction efficiency; light output degradation; materials challenges; packaging materials; viable lighting source; Conducting materials; LED lamps; Light emitting diodes; Packaging; Refractive index; Temperature; Thermal degradation; Thermal management; Thermal resistance; Thermal stresses;
Conference_Titel :
Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International
Conference_Location :
Taipei
Print_ISBN :
1-4244-0735-4
Electronic_ISBN :
1-4244-0735-4
DOI :
10.1109/IMPACT.2006.312173
