Title :
Multi-switch Si-chip structures and on-substrate packaging techniques for improving the electrical performance of power modules
Author :
El khadiry, A. ; Richardeau, Frederic ; Bourennane, A. ; Zhifeng, D. ; Breil, Marie
Author_Institution :
LAAS, Toulouse, France
Abstract :
Starting from the common anode and common cathode multi-switch Si-chips, this paper focuses on the different association techniques of the two power chips on the usual substrates (DBC/IMS). The study uses 3D multiphysics COMSOL simulations to determine the best association that would allow the best electrical performance of power converters.
Keywords :
integrated circuit packaging; modules; power convertors; power integrated circuits; 3D multiphysics COMSOL simulations; DBC-IMS; Si; association techniques; common anode multiswitch silicon-chips; common cathode multiswitch silicon-chip structures; electrical performance; on-substrate packaging techniques; power chips; power converters; power modules; Anodes; Cathodes; Inductance; Substrates; Switches; Wires;
Conference_Titel :
Power Electronics and Applications (EPE), 2013 15th European Conference on
Conference_Location :
Lille
DOI :
10.1109/EPE.2013.6634426
