DocumentCode :
1584455
Title :
High-performance bulk CMOS technology with millisecond annealing and strained Si
Author :
Sugii, T. ; Ikeda, K. ; Miyashita, T.
Author_Institution :
FUJITSU LABORATORIES LTD., 1500 Mizono, Tado-cho, Mie-ken, 511-0192, Japan
fYear :
2008
Firstpage :
37
Lastpage :
42
Abstract :
High-performance planar, bulk CMOS technology for 45nm nodes and beyond is reviewed from the point of mobility enhancement techniques and millisecond annealing techniques. Through continuous efforts to increase on-current with the strained techniques while scaling transistor dimensions with millisecond annealing, competitive high-end CMOS technology for 45nm node was realized.
Keywords :
Annealing; CMOS process; CMOS technology; Capacitive sensors; Costs; DSL; MOSFETs; Stress; Surface-mount technology; Transconductance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Advanced Thermal Processing of Semiconductors, 2008. RTP 2008. 16th IEEE International Conference on
Conference_Location :
Las Vegas, NV, USA
Print_ISBN :
978-1-4244-1950-0
Electronic_ISBN :
978-1-4244-1951-7
Type :
conf
DOI :
10.1109/RTP.2008.4690536
Filename :
4690536
Link To Document :
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