Development of Optimizing Process Flow and Materials Selection for Optical Device Packages

Author

Yen, Tzu-Yin ; Yeh, Chung-Mao ; Huang, Chin-Ching ; Tu, Min-Te

Author_Institution

Dept. of Res. & Dev., Lingsen Precision Ind., Tainan

fYear

2006

Firstpage

1

Lastpage

3

Abstract

Rainbow phenomenon after lid sealing on package for optical device is a major defect in optical package assembly. UV adhesive effectiveness, AR glass and substrate selection are important to eliminate rainbow fringes. After design of experiment (DOE) studies, the optimizing process, best materials combination were found. The optical package passed moisture sensitivity level (MSL)3 at 260degC test

Keywords

assembling; design of experiments; electronics packaging; materials testing; optical glass; optoelectronic devices; 260 degC; AR glass; DOE; UV adhesive effectiveness; design of experiment; lid sealing; materials combination; materials selection; moisture sensitivity level; optical device packages; optical package assembly; optimizing process flow; rainbow fringes; substrate selection; Assembly; Design optimization; Glass; Image motion analysis; Moisture; Optical devices; Optical materials; Optical sensors; Packaging; US Department of Energy; AR glass; DOE; Rainbow phenomenon; UV adhesive;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly Conference Taiwan, 2006. IMPACT 2006. International

Conference_Location

Taipei

Print_ISBN

1-4244-0735-4

Electronic_ISBN

1-4244-0735-4

Type

conf

DOI

10.1109/IMPACT.2006.312179

Filename

4107481