• DocumentCode
    1585099
  • Title

    High precision micro-scale Hall effect characterization method using in-line micro four-point probes

  • Author

    Petersen, Dirch Hjorth ; Hansen, Ole ; Lin, Richard ; Nielsen, Peter Folmer ; Clarysse, Trudo ; Goossens, J. ; Rosseel, E. ; Vandervorst, W.

  • Author_Institution
    DTU Nanotech - Dept. of Micro and Nanotechnology, Technical University of Denmark, B-345 East, DK-2800 Kgs. Lyngby, Denmark
  • fYear
    2008
  • Firstpage
    251
  • Lastpage
    256
  • Abstract
    Accurate characterization of ultra shallow junctions (USJ) is important in order to understand the principles of junction formation and to develop the appropriate implant and annealing technologies. We investigate the capabilities of a new micro-scale Hall effect measurement method where Hall effect is measured with collinear micro four-point probes (M4PP). We derive the sensitivity to electrode position errors and describe a position error suppression method to enable rapid reliable Hall effect measurements with just two measurement points. We show with both Monte Carlo simulations and experimental measurements, that the repeatability of a micro-scale Hall effect measurement is better than 1 %. We demonstrate the ability to spatially resolve Hall effect on micro-scale by characterization of an USJ with a single laser stripe anneal. The micro sheet resistance variations resulting from a spatially inhomogeneous anneal temperature are found to be directly correlated to the degree of dopant activation.
  • Keywords
    Annealing; Appropriate technology; Electrical resistance measurement; Electrodes; Hall effect; Implants; Position measurement; Probes; Spatial resolution; Temperature; Hall effect; USJ; dose; four-point probe; laser anneal; mobility; sheet resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Thermal Processing of Semiconductors, 2008. RTP 2008. 16th IEEE International Conference on
  • Conference_Location
    Las Vegas, NV, USA
  • Print_ISBN
    978-1-4244-1950-0
  • Electronic_ISBN
    978-1-4244-1951-7
  • Type

    conf

  • DOI
    10.1109/RTP.2008.4690563
  • Filename
    4690563