Title :
1998 Fourth International High Temperature Electronics Conference. HITEC (Cat. No.98EX145)
Abstract :
The following topics were covered: SiC materials; SiC devices characterisation; high temperature circuits; packaging; contacts; reliability, lifetime and testing, compound semiconductors and novel materials; modelling; passive components; silicon; and sensors
Keywords :
high-temperature electronics; life testing; monolithic integrated circuits; ohmic contacts; packaging; reliability; semiconductor devices; sensors; wide band gap semiconductors; Si; SiC; SiC devices characterisation; SiC materials; compound semiconductors; contacts; high temperature circuits; high temperature electronics; lifetime testing; modelling; packaging; passive components; reliability; sensors;
Conference_Titel :
High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International
Conference_Location :
Albuquerque, NM, USA
Print_ISBN :
0-7803-4540-1
DOI :
10.1109/HITEC.1998.676749
