Title :
Experimental and analytical durability assessment of high-temperature, fatigue-resistant solders. I. Constitutive properties
Author :
Haswell, P. ; Choi, H. ; Dasgupta, A.
Author_Institution :
CALCE Electron. Packaging Res. Center, Maryland Univ., College Park, MD, USA
Abstract :
Summary form only given. There is significant need to pursue the development of fatigue-resistant solders for high temperature applications. Use of these solders can result in cost-effective, reliable packaging for extreme environments and/or platforms that do not have expensive active thermal management systems. The durability of high melting-point solders is studied experimentally using a creep-fatigue damage model, i.e., the energy-partitioning model, along with associated creep and plastic constitutive behavior
Keywords :
creep; fatigue; high-temperature electronics; packaging; plastic deformation; soldering; creep constitutive behavior; creep-fatigue damage model; durability assessment; energy-partitioning model; extreme environments; fatigue-resistant solders; high melting-point solders; high-temperature solders; plastic constitutive behavior; reliable packaging; Capacitive sensors; Creep; Deformable models; Displacement measurement; Electronic packaging thermal management; Plastics; Soldering; Temperature; Testing; Thermal management;
Conference_Titel :
High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International
Conference_Location :
Albuquerque, NM
Print_ISBN :
0-7803-4540-1
DOI :
10.1109/HITEC.1998.676762
