Title :
Research progress on free-space-wave add/drop multiplexing for WDM optical-interconnect system in packaging
Author :
Ura, Shogo ; Kintaka, Kenji
Author_Institution :
Kyoto Inst. of Technol., Kyoto, Japan
Abstract :
Integrated-optic devices enabling intra-board chip-to-chip optical interconnection with tens-terabit-per-second transmission bandwidth from two-dimensional (2D) array of vertical-cavity surface-emitting lasers to 2D array of photodiodes are reviewed. Design strategy and preliminary experimental results on wavelength-division-multiplexing signal transmission are also presented and discussed.
Keywords :
electronics packaging; photodiodes; wavelength division multiplexing; WDM optical-interconnect system; free-space-wave add/drop multiplexing; integrated-optic devices; intra-board chip-to-chip optical interconnection; packaging; photodiodes; tens-terabit-per-second transmission bandwidth; two-dimensional array; wavelength-division-multiplexing signal transmission; Bandwidth; Optical arrays; Optical interconnections; Optical surface waves; Packaging; Photodiodes; Signal design; Surface emitting lasers; Vertical cavity surface emitting lasers; Wavelength division multiplexing; grating couplers; guided modes; integrated optics; optical interconnects; optical waveguides; wavelength division multiplexing;
Conference_Titel :
Transparent Optical Networks (ICTON), 2010 12th International Conference on
Conference_Location :
Munich
Print_ISBN :
978-1-4244-7799-9
Electronic_ISBN :
978-1-4244-7797-5
DOI :
10.1109/ICTON.2010.5549273
