Title :
An alternative packaging solution for moderate HOT environments in high volume applications
Author :
Gallagher, Catherine ; Matijasevic, Goran ; Shearer, Bryan ; Xi, Xiaomei
Author_Institution :
Ormet Corp., Carlsbad, CA, USA
Abstract :
Summary form only given. We have developed an electronic packaging technology in which the circuits are directly deposited onto insulated metal substrates. This packaging has several fold better thermal conductivity than conventional ceramic or polyimide glued-to-heat-sink high operating temperature (HOT) packaging, is more mechanically robust than ceramic, is lightweight and compact and can be deposited on 3-dimensional surfaces to minimize space requirements. Multilayer circuits with dimensions as small as 50 μm lines and spaces 75 μm vias are possible as well as large dimension circuits for power applications. This approach is also more cost effective than conventional HOT packaging
Keywords :
high-temperature electronics; thermal conductivity; thermal management (packaging); 135 to 200 C; HOT environment; electronic packaging; high operating temperature; insulated metal substrate; multilayer circuit; thermal conductivity; Ceramics; Circuits; Electronic packaging thermal management; Electronics packaging; Insulation; Polyimides; Robustness; Space technology; Temperature; Thermal conductivity;
Conference_Titel :
High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International
Conference_Location :
Albuquerque, NM
Print_ISBN :
0-7803-4540-1
DOI :
10.1109/HITEC.1998.676767
