DocumentCode
1586494
Title
Reliability of high temperature electronic components
Author
Anderson, Wallace T.
Author_Institution
Naval Res. Lab., Washington, DC, USA
fYear
1998
Firstpage
148
Lastpage
150
Abstract
A review is given of high temperature reliability efforts on solid-state electronic components. To date, most of this work has been concerned with high temperature stressing, usually for short periods of time (less than 100 hours) to demonstrate stability. To field high temperature devices in the future, comprehensive high temperature reliability studies will be required
Keywords
high-temperature electronics; reviews; semiconductor device reliability; high temperature electronic components; high temperature stressing; reliability; stability; Electronic components; FETs; Gallium arsenide; Integrated circuit reliability; Laboratories; Microwave devices; Power system reliability; Semiconductor device reliability; Semiconductor devices; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International
Conference_Location
Albuquerque, NM
Print_ISBN
0-7803-4540-1
Type
conf
DOI
10.1109/HITEC.1998.676777
Filename
676777
Link To Document