Title :
Evaluation of the submodel technique for FEM simulations of power electronic housings under power cycling conditions
Author :
Tinschert, Lukas ; Hofmann, Klaus ; Poller, Tilo ; Lutz, Josef
Author_Institution :
Dept. of Power Electron. & EMC, Chemnitz Univ. of Technol., Chemnitz, Germany
Abstract :
The submodel technique was mainly developed in mechanical engineering for complex parts and assemblies. In the simulations of microelectronics housing the technique was successful implemented for thermal cycling conditions. In thispaper the evaluation of the submodel technique for power electronic packages under power cycling conditions will be discussed.
Keywords :
electronics packaging; finite element analysis; power electronics; FEM simulations; complex assemblies; complex parts; mechanical engineering; microelectronics housing; power cycling conditions; power electronic housings; power electronic packages; submodel technique; thermal cycling conditions; Abstracts; Analytical models; Temperature distribution; Thermal analysis; Discrete power device; Modelling; Packaging; Power cycling; Reliability; Simulation; Thermal stress;
Conference_Titel :
Power Electronics and Applications (EPE), 2013 15th European Conference on
Conference_Location :
Lille
DOI :
10.1109/EPE.2013.6634614
