Title :
Chemical metallization of ceramic substrates-an alternative to thick and thin film technology
Author_Institution :
Fraunhofer-Inst. for Solid State Technol., Munich, West Germany
Abstract :
The material properties of chemically deposited copper and patterning techniques are described. This is followed by a depiction of the RF capability and important mechanical properties such as adhesive strength, solderability, and bondability. Starting points for the integration of resistors and multilayer metallizations are suggested. An example for practical application is given.<>
Keywords :
ceramics; integrated circuit technology; metallisation; RF capability; adhesive strength; bondability; ceramic substrates; metallization; multilayer metallizations; patterning techniques; resistors; solderability; Adhesive strength; Bonding; Ceramics; Chemicals; Copper; Material properties; Mechanical factors; Metallization; Radio frequency; Resistors;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location :
Lake Buena Vista, FL, USA
DOI :
10.1109/EMTS.1988.16159
