Reliability issues in deep deep sub-micron technologies: time-dependent variability and its impact on embedded system design

Technology scaling has traditionally offered advantages to embedded system design in terms of reduced energy consumption and cost and increased performance. Scaling past the 45 nm technology node, however, brings a host of problems, whose impact on system-level design has not been evaluated. Random intra-die process variability, reliability and their combined impact on the system level parametric quality metrics are effects that are gaining prominence and that needs to be tackled in the next few years. Dealing with these new challenges requires a paradigm shift in the system level design phase