• DocumentCode
    1587002
  • Title

    Measurement of the cylinder pressure in combustion engines with a piezoresistive β-SiC-on-SOI pressure sensor

  • Author

    von Berg, J. ; Ziermann, R. ; Reichert, W. ; Obermeier, E. ; Eickhoff, M. ; Krötz, G. ; Thoma, U. ; Cavalloni, C. ; Nendza, J.P.

  • Author_Institution
    Microsensor & Actuator Technol. Center, Tech. Univ. Berlin, Germany
  • fYear
    1998
  • Firstpage
    245
  • Lastpage
    249
  • Abstract
    For measuring the cylinder pressure in combustion engines a high temperature pressure sensor has been developed. The sensor is made of a piezoresistive β-SiC-on-SOI (SiCOI) sensor chip and a specially designed housing. The SiCOI sensor was characterized under static pressure up to 20 MPa. The sensitivity of the sensor at room temperature is approximately 1.9 mV/MPa and decreases to about 1.2 mV/MPa at 300°C. For monitoring the dynamic cylinder pressure in the combustion chamber the SiCOI sensor was placed into the cylinder head of a gasoline engine. The measurements were performed at 1500 rpm under different loads, and for comparison a quartz pressure transducer from Kistier was used as a reference. The maximum pressure at partial load operation amounts to about 2.0 MPa. The difference between the calibrated SiCOI sensor and the reference sensor is significantly less than 0.1 MPa during the whole operation
  • Keywords
    high-temperature electronics; internal combustion engines; piezoelectric semiconductors; piezoresistive devices; pressure measurement; pressure sensors; semiconductor materials; silicon compounds; silicon-on-insulator; 0 to 2.0 MPa; 300 degC; SiC-Si; combustion engines; cylinder head; cylinder pressure; dynamic cylinder pressure; gasoline engine; high temperature pressure sensor; partial load operation; piezoresistive SOI pressure sensor; static pressure; Combustion; Engine cylinders; Monitoring; Performance evaluation; Petroleum; Piezoresistance; Pressure measurement; Semiconductor device measurement; Sensor phenomena and characterization; Temperature sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International
  • Conference_Location
    Albuquerque, NM
  • Print_ISBN
    0-7803-4540-1
  • Type

    conf

  • DOI
    10.1109/HITEC.1998.676796
  • Filename
    676796