DocumentCode :
1587047
Title :
6H-SiC pressure sensor operation at 600°C
Author :
Ned, Alexander A. ; Okojie, Robert S. ; Kurtz, Anthony D.
Author_Institution :
Kulite Semicond. Products, Leonia, NJ, USA
fYear :
1998
Firstpage :
257
Lastpage :
260
Abstract :
Experimental results of batch-microfabricated 6H-SiC piezoresistive pressure sensors operational between room temperature to 600°C are reported. For a diaphragm thickness of 30 μm, the typical room temperature full-scale output for maximum pressure of 1000 psi was 66.41 mV, with a hysteresis and nonlinearity of less than 1%FSO across the range of operating temperature. For a diaphragm thickness of 40 μm, the typical room temperature full-scale output for maximum pressure of 1000 psi was between 39 mV and 42 mV, also with a hysteresis and nonlinearity of less than 1% across the range of operating temperature. The temperature coefficient of resistance (TCR) had negative values from room temperature to 350°C due to the gradual drop in input resistance. The temperature coefficient of gauge factor (TCGF) averaged about -0.14%/°C from room temperature to 600°C. These values obtained were consistent with the characteristics of 6H-SiC epilayer having an impurity concentration of 2×1019 cm -3
Keywords :
high-temperature electronics; piezoelectric semiconductors; piezoresistive devices; pressure sensors; semiconductor epitaxial layers; silicon compounds; 20 to 600 degC; 30 micron; 39 to 42 mV; 40 micron; 66.41 mV; SiC; diaphragm thickness; epilayer; hysteresis; impurity concentration; input resistance; operating temperature; piezoresistive pressure sensors; room temperature full-scale output; temperature coefficient of gauge factor; temperature coefficient of resistance; Capacitive sensors; Compressive stress; Electromechanical sensors; Packaging; Piezoresistance; Resistors; Silicon carbide; Temperature distribution; Temperature sensors; Tensile stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International
Conference_Location :
Albuquerque, NM
Print_ISBN :
0-7803-4540-1
Type :
conf
DOI :
10.1109/HITEC.1998.676799
Filename :
676799
Link To Document :
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