• DocumentCode
    1587047
  • Title

    6H-SiC pressure sensor operation at 600°C

  • Author

    Ned, Alexander A. ; Okojie, Robert S. ; Kurtz, Anthony D.

  • Author_Institution
    Kulite Semicond. Products, Leonia, NJ, USA
  • fYear
    1998
  • Firstpage
    257
  • Lastpage
    260
  • Abstract
    Experimental results of batch-microfabricated 6H-SiC piezoresistive pressure sensors operational between room temperature to 600°C are reported. For a diaphragm thickness of 30 μm, the typical room temperature full-scale output for maximum pressure of 1000 psi was 66.41 mV, with a hysteresis and nonlinearity of less than 1%FSO across the range of operating temperature. For a diaphragm thickness of 40 μm, the typical room temperature full-scale output for maximum pressure of 1000 psi was between 39 mV and 42 mV, also with a hysteresis and nonlinearity of less than 1% across the range of operating temperature. The temperature coefficient of resistance (TCR) had negative values from room temperature to 350°C due to the gradual drop in input resistance. The temperature coefficient of gauge factor (TCGF) averaged about -0.14%/°C from room temperature to 600°C. These values obtained were consistent with the characteristics of 6H-SiC epilayer having an impurity concentration of 2×1019 cm -3
  • Keywords
    high-temperature electronics; piezoelectric semiconductors; piezoresistive devices; pressure sensors; semiconductor epitaxial layers; silicon compounds; 20 to 600 degC; 30 micron; 39 to 42 mV; 40 micron; 66.41 mV; SiC; diaphragm thickness; epilayer; hysteresis; impurity concentration; input resistance; operating temperature; piezoresistive pressure sensors; room temperature full-scale output; temperature coefficient of gauge factor; temperature coefficient of resistance; Capacitive sensors; Compressive stress; Electromechanical sensors; Packaging; Piezoresistance; Resistors; Silicon carbide; Temperature distribution; Temperature sensors; Tensile stress;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International
  • Conference_Location
    Albuquerque, NM
  • Print_ISBN
    0-7803-4540-1
  • Type

    conf

  • DOI
    10.1109/HITEC.1998.676799
  • Filename
    676799