DocumentCode :
1587060
Title :
Advanced SPICE-modelling of 6H-SiC-JFETs including substrate effects
Author :
Zappe, S. ; Obermeier, E. ; Sheppard, S.T. ; Schmid, U. ; Lauer, V. ; Wondrak, W.
Author_Institution :
Microsensor & Actuator Technol. Center, Tech. Univ. Berlin, Germany
fYear :
1998
Firstpage :
261
Lastpage :
264
Abstract :
This work presents an expression for the drain source current I D, suitable for SPICE simulations of a 6H-SiC-JFET with an implanted gate area. Due to the lack of semi-insulating 6H substrates, such a JFET is influenced by the gate- and the substrate-channel-pn-junction and cannot be described with common JFET SPICE models. Accurate modeling is achieved by introducing a saturation voltage parameter α(VGS) similar to that used for the description of GaAs-MESFETs (VGS=gate source voltage). The applicability of the model is demonstrated using measurements on 6H-SiC-JFETs fabricated by Daimler Bent AG, Frankfurt. Even characteristics measured at 400°C are successfully modelled
Keywords :
SPICE; high-temperature electronics; junction gate field effect transistors; semiconductor device models; semiconductor device reliability; semiconductor materials; silicon compounds; 400 degC; JFETs; SPICE; SiC; drain source current; gate-channel-pn-junction; implanted gate area; saturation voltage parameter; semiconductor device modelling; substrate effects; substrate-channel-pn-junction; Actuators; Integrated circuit measurements; Integrated circuit modeling; MOSFETs; Microsensors; SPICE; Silicon carbide; Thermionic emission; USA Councils; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Temperature Electronics Conference, 1998. HITEC. 1998 Fourth International
Conference_Location :
Albuquerque, NM
Print_ISBN :
0-7803-4540-1
Type :
conf
DOI :
10.1109/HITEC.1998.676800
Filename :
676800
Link To Document :
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