• DocumentCode
    1587097
  • Title

    Real-time degradation monitoring and lifetime estimation of 3D integrated bond-wire-less double-sided cooled power switch technologies

  • Author

    Tianxiang Dai ; Jian Feng Li ; Corfield, Martin ; Castellazzi, Alberto ; Wheeler, Pat

  • Author_Institution
    Power Electron., Machines & Control (PEMC) Group, Univ. of Nottingham, Nottingham, UK
  • fYear
    2013
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    This paper introduces a methodology for real-time degradation monitoring and reliability assessment of novel sandwich-type integrated power switches during passive thermal cycling. The proposed approach enables to realistically monitor degradation from time zero, allowing the flexible definition of the most suitable failure criteria and test time.
  • Keywords
    failure analysis; power semiconductor switches; reliability; 3D integrated bond-wire-less double-sided cooled power switch technologies; failure criteria; lifetime estimation; passive thermal cycling; real-time degradation monitoring; reliability assessment; sandwich-type integrated power switches; test time; Assembly; Cooling; Degradation; Insulated gate bipolar transistors; Reliability; Switches; Temperature measurement; Bondwire-less interconnection; Double-Sided Cooling; Packaging; Reliability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Electronics and Applications (EPE), 2013 15th European Conference on
  • Conference_Location
    Lille
  • Type

    conf

  • DOI
    10.1109/EPE.2013.6634636
  • Filename
    6634636
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1587097