DocumentCode :
158770
Title :
Post-arc sheath simulation in vacuum circuit breaker with one-dimensional particle in cell-Monte Carlo collisions method
Author :
Mo, Y.P. ; Shi, Z. ; Jia, S. ; Wang, L.
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fYear :
2014
fDate :
Sept. 28 2014-Oct. 3 2014
Firstpage :
185
Lastpage :
188
Abstract :
In this paper, a one-dimensional (1-D) particle in cell-Monte Carlo collisions (PIC-MCC) model is developed to study the process of post-arc sheath expansion. In this model, both electrons and ions are treated as particles with their thermal velocities obeying the Maxwell-Boltzmann velocity distribution. The model takes the collision effects of ion-neutral (charge exchange collision and momentum exchange collision), and electron-neutral (scatter collision, excitation collision and ionization collision) into consideration. The simulation results are also compared with that calculated by the classical continuous transition model (CTM). In present work, the influence of some important factors, e.g. the density of initial residual plasma, the density of background metal vapor, the rising rate of transient recovery voltage (TRV) on the sheath expanding process are investigated.
Keywords :
Boltzmann equation; Monte Carlo methods; arcs (electric); plasma collision processes; plasma density; plasma sheaths; plasma simulation; vacuum circuit breakers; Maxwell-Boltzmann velocity distribution; PIC-MCC model; cell-Monte Carlo collisions method; charge exchange collision; initial residual plasma; momentum exchange collision; one-dimensional particle; post-arc sheath simulation; rising rate; thermal velocity; transient recovery voltage; vacuum circuit breaker; Anodes; Integrated circuit modeling; Metals; Plasma density; Transient analysis; Vacuum arcs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
Conference_Location :
Mumbai
Print_ISBN :
978-1-4799-6750-6
Type :
conf
DOI :
10.1109/DEIV.2014.6961650
Filename :
6961650
Link To Document :
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