• DocumentCode
    1587835
  • Title

    Preparation of polycrystalline silicon thin films by pulsed ion-beam evaporation

  • Author

    Yang, S.-C. ; Suzuki, T. ; Jiang, W. ; Yatsui, K.

  • Author_Institution
    Extreme Energy-Density Res. Inst., Nagaoka Univ. of Technol., Niigata, Japan
  • Volume
    2
  • fYear
    2001
  • Firstpage
    1842
  • Abstract
    By intense pulsed ion beam evaporation, we have succeeded in the preparation of polycrystalline silicon thin films on silicon substrate. High crystallinity and deposition rate have been achieved without heating the substrate. The crystallinity of poly-Si film has been improved with increasing the density of the ablation plasma, where the grain size of the film has been found to be much smaller. To enhance the crystallinity and density of poly-Si thin film, bias voltage was applied to the substrate, where the quality of poly-Si film has been improved by the ion bombardment.
  • Keywords
    elemental semiconductors; evaporation; ion beam effects; plasma deposition; semiconductor thin films; silicon; Si; Si substrate; ablation plasma density; bias voltage; crystallinity; deposition rate; grain size; intense pulsed ion beam evaporation; ion bombardment; plasma deposition; poly-Si film density; poly-Si film quality; polycrystalline silicon thin films preparation; Crystallization; Grain size; Heating; Ion beams; Plasma density; Semiconductor thin films; Silicon; Substrates; Transistors; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Pulsed Power Plasma Science, 2001. PPPS-2001. Digest of Technical Papers
  • Conference_Location
    Las Vegas, NV, USA
  • Print_ISBN
    0-7803-7120-8
  • Type

    conf

  • DOI
    10.1109/PPPS.2001.1001933
  • Filename
    1001933