DocumentCode
1587835
Title
Preparation of polycrystalline silicon thin films by pulsed ion-beam evaporation
Author
Yang, S.-C. ; Suzuki, T. ; Jiang, W. ; Yatsui, K.
Author_Institution
Extreme Energy-Density Res. Inst., Nagaoka Univ. of Technol., Niigata, Japan
Volume
2
fYear
2001
Firstpage
1842
Abstract
By intense pulsed ion beam evaporation, we have succeeded in the preparation of polycrystalline silicon thin films on silicon substrate. High crystallinity and deposition rate have been achieved without heating the substrate. The crystallinity of poly-Si film has been improved with increasing the density of the ablation plasma, where the grain size of the film has been found to be much smaller. To enhance the crystallinity and density of poly-Si thin film, bias voltage was applied to the substrate, where the quality of poly-Si film has been improved by the ion bombardment.
Keywords
elemental semiconductors; evaporation; ion beam effects; plasma deposition; semiconductor thin films; silicon; Si; Si substrate; ablation plasma density; bias voltage; crystallinity; deposition rate; grain size; intense pulsed ion beam evaporation; ion bombardment; plasma deposition; poly-Si film density; poly-Si film quality; polycrystalline silicon thin films preparation; Crystallization; Grain size; Heating; Ion beams; Plasma density; Semiconductor thin films; Silicon; Substrates; Transistors; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Pulsed Power Plasma Science, 2001. PPPS-2001. Digest of Technical Papers
Conference_Location
Las Vegas, NV, USA
Print_ISBN
0-7803-7120-8
Type
conf
DOI
10.1109/PPPS.2001.1001933
Filename
1001933
Link To Document