• DocumentCode
    158796
  • Title

    Numerical simulation of anode thermal processes of different materials in vacuum arc

  • Author

    Huang, X.L. ; Wang, L. ; Jia, S. ; Wang, Harry Jiannan ; Qian, Z.H. ; Shi, Z.

  • Author_Institution
    State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
  • fYear
    2014
  • fDate
    Sept. 28 2014-Oct. 3 2014
  • Firstpage
    289
  • Lastpage
    292
  • Abstract
    Electrode material seriously influences the characteristics of vacuum arc and further affects the performance of switches. In this paper, thermal processes of six kinds of metal anodes (including pure metal and alloy anodes) are simulated and researched. Two kinds of temperature calculation methods are used. Simulation results show that W and Mo anodes have the higher temperature than Cu, Cr, CuCr25 and CuCr50 anodes. Pure Cr anode has the biggest melting width, and highest saturated vapor pressure. Cu anode has the biggest melting depth. W anode has the smallest melting area. Axial temperature gradient is related to the thermal conductivity, the Cr anode has the largest axial temperature gradient. The thermal characteristics of CuCr25 and CuCr50 anodes are located between the pure Cu and Cr anodes. There are two melting points appear in the results of CuCr alloys, between the two melting points, the alloy anodes are in solid-liquid mixture state.
  • Keywords
    electrochemical electrodes; melting; melting point; numerical analysis; power semiconductor switches; vacuum arcs; alloy anodes; anode thermal process; axial temperature gradient; electrode material; melting depth; melting points; melting width; numerical simulation; pure metal anodes; saturated vapor pressure; solid-liquid mixture state; temperature calculation methods; thermal conductivity; vacuum arc; Anodes; Conductivity; Heating; Materials; Metals; Temperature; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
  • Conference_Location
    Mumbai
  • Print_ISBN
    978-1-4799-6750-6
  • Type

    conf

  • DOI
    10.1109/DEIV.2014.6961676
  • Filename
    6961676