DocumentCode
158796
Title
Numerical simulation of anode thermal processes of different materials in vacuum arc
Author
Huang, X.L. ; Wang, L. ; Jia, S. ; Wang, Harry Jiannan ; Qian, Z.H. ; Shi, Z.
Author_Institution
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fYear
2014
fDate
Sept. 28 2014-Oct. 3 2014
Firstpage
289
Lastpage
292
Abstract
Electrode material seriously influences the characteristics of vacuum arc and further affects the performance of switches. In this paper, thermal processes of six kinds of metal anodes (including pure metal and alloy anodes) are simulated and researched. Two kinds of temperature calculation methods are used. Simulation results show that W and Mo anodes have the higher temperature than Cu, Cr, CuCr25 and CuCr50 anodes. Pure Cr anode has the biggest melting width, and highest saturated vapor pressure. Cu anode has the biggest melting depth. W anode has the smallest melting area. Axial temperature gradient is related to the thermal conductivity, the Cr anode has the largest axial temperature gradient. The thermal characteristics of CuCr25 and CuCr50 anodes are located between the pure Cu and Cr anodes. There are two melting points appear in the results of CuCr alloys, between the two melting points, the alloy anodes are in solid-liquid mixture state.
Keywords
electrochemical electrodes; melting; melting point; numerical analysis; power semiconductor switches; vacuum arcs; alloy anodes; anode thermal process; axial temperature gradient; electrode material; melting depth; melting points; melting width; numerical simulation; pure metal anodes; saturated vapor pressure; solid-liquid mixture state; temperature calculation methods; thermal conductivity; vacuum arc; Anodes; Conductivity; Heating; Materials; Metals; Temperature; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
Conference_Location
Mumbai
Print_ISBN
978-1-4799-6750-6
Type
conf
DOI
10.1109/DEIV.2014.6961676
Filename
6961676
Link To Document