Title :
Dielectric recovery strength after vacuum arc extinctions
Author :
Zhenxing Wang ; Yunbo Tian ; Hui Ma ; Yingsan Geng ; Zhiyuan Liu
Author_Institution :
State Key Lab. of Electr. Insulation & Power Equip., Xi´an Jiaotong Univ., Xi´an, China
fDate :
Sept. 28 2014-Oct. 3 2014
Abstract :
Anode surface temperature after interrupting a vacuum arc has a significant impact on the interruption capacity of a vacuum circuit breaker (VCB) because it dominates metal vapor evaporation. The objective of this paper is to theoretically investigate the relationship between breakdown voltages and anode surface temperatures after current zero. A heat transfer model was established to describe the temperature development on an anode surface, taking account of phase transition processes. The contact material was copper. Moreover, PIC-MCC was adopted to simulate the breakdown voltages in a range of metal vapor density. The calculated results verified the two decay modes of anode surface temperature after current zero proposed by our experiments. The metal vapor density evaporated from an anode surface was positive correlated with its temperature. The breakdown voltage was negative correlated with the anode temperature. A higher surface temperature results in a higher probability of breakdown. Thus, it is better to keep the initial surface temperature at current zero below a certain value.
Keywords :
Monte Carlo methods; anodes; copper; heat transfer; plasma density; plasma simulation; plasma switches; plasma temperature; vacuum arcs; vacuum breakdown; vacuum circuit breakers; Cu; PIC-MCC; anode surface temperature; anode surface temperatures; breakdown voltage; breakdown voltages; copper contact material; dielectric recovery strength; heat transfer model; metal vapor density; metal vapor evaporation; phase transition processes; vacuum arc; vacuum circuit breaker; Anodes; Heating; Materials; Metals; Plasma temperature; Surface treatment; Vacuum arcs;
Conference_Titel :
Discharges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
Conference_Location :
Mumbai
Print_ISBN :
978-1-4799-6750-6
DOI :
10.1109/DEIV.2014.6961687