DocumentCode :
1588082
Title :
Optical I/O for chip-to-chip interconnects on CMOS platform
Author :
Chang, Peter L D ; Mohammed, Edris M. ; Block, Bruce A. ; Reshotko, Miriam R. ; Young, Ian A.
Author_Institution :
Technol. & Manuf. Group, Intel, Hillsboro, OH, USA
fYear :
2011
Firstpage :
1
Lastpage :
3
Abstract :
Optical devices on a CMOS die and package for terabit computing are discussed. 200Gbps transmission is accomplished with a 1×10 VCSEL array. CMOS backend compatible modulators and photodetectors are demonstrated at 40Gbps for on-die integration.
Keywords :
CMOS integrated circuits; optical interconnections; surface emitting lasers; CMOS backend compatible modulators; VCSEL array; bit rate 200 Gbit/s; bit rate 40 Gbit/s; chip-to-chip interconnects; optical I/O; optical devices; photodetectors; terabit computing; CMOS integrated circuits; High speed optical techniques; Modulation; Optical coupling; Optical fibers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Optical Fiber Communication Conference and Exposition (OFC/NFOEC), 2011 and the National Fiber Optic Engineers Conference
Conference_Location :
Los Angeles, CA
ISSN :
pending
Print_ISBN :
978-1-4577-0213-6
Type :
conf
Filename :
5875472
Link To Document :
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