Title :
Exploiting parallelism to boost data-path rate in high-speed IP/MPLS networking
Author :
Widjaja, Indra ; Elwalid, Anwar I.
Author_Institution :
Lucent Technol. Bell Labs., Murray Hill, NJ, USA
Abstract :
Link bundling is a way to increase routing scalability whenever a pair of label switching routers in MPLS are connected by multiple parallel links. However, link bundling can be inefficient as a label switched path (LSP) has to be associated with a particular link. In this paper, we show that the efficiency of link bundling can be significantly improved if traffic can be effectively distributed across the parallel links. We propose an IP switch architecture that is capable of distributing flows both inside the switch and among the parallel links based on operations that are relatively simple to implement. The switch requires no speedup, guarantees in-sequence packet delivery for a given flow, avoids complex coordination algorithms, and can achieve LSP throughput higher than the line rate. By means of simulation using IP traces, we investigate the performance of the proposed switch, and show that the switch achieves good load-balancing performance. We describe extensions to the basic architecture which allows for very large bundle size, handles incremental upgrade strategy, improves reliability, and accommodates nonIP traffic.
Keywords :
IP networks; multiprotocol label switching; routing protocols; telecommunication links; telecommunication traffic; IP switch architecture; IP/MPLS networking; complex coordination algorithms; data-path rate; in-sequence packet delivery; incremental upgrade strategy; label switched path throughput; label switching routers; link bundling; link hashing; load-balancing performance; multiple parallel links; nonIP traffic; Intelligent networks; Multiprotocol label switching; Packet switching; Protocols; Routing; Scalability; Spine; Switches; Telecommunication traffic; Throughput;
Conference_Titel :
INFOCOM 2003. Twenty-Second Annual Joint Conference of the IEEE Computer and Communications. IEEE Societies
Print_ISBN :
0-7803-7752-4
DOI :
10.1109/INFCOM.2003.1208707