Frequency scanning of power electronic-based smart grids: The modular multilevel converter application

Author

Bergna, Gilbert ; Sanchez, Santiago ; Berne, E. ; Egrot, P. ; Vannier, J.-C. ; Molinas, Marta

Author_Institution

Supelec, Gif-sur-Yvette, France

fYear

2014

fDate

8-10 April 2014

Firstpage

1

Lastpage

5

Abstract

The Multi-terminal HVdc systems is a key technology for bulk power transmission. The stability analysis of such power electronics-dominated power systems is a new challenge. This paper focuses on the analysis based on impedance representation of a modular multilevel converter. Therefore, a small signal input impedance modeling method is described for high and low frequencies. A comparative evaluation with the impedance obtained via simulations was performed by the application of a voltage perturbation to the DC side. In addition, the stability of the interconnection of two MMCs´ in a Back-to-Back configuration was analyzed by means of Nyquist criteria.

Keywords

HVDC power convertors; Nyquist criterion; electric impedance; power system stability; smart power grids; DC side; Nyquist criteria; back-to-back configuration; bulk power transmission; frequency scanning; impedance representation; modular multilevel converter application; multiterminal HVdc system; power electronic-based smart grids; power electronics-dominated power systems; small signal input impedance modeling method; stability analysis; voltage perturbation;

fLanguage

English

Publisher

iet

Conference_Titel

Power Electronics, Machines and Drives (PEMD 2014), 7th IET International Conference on

Conference_Location

Manchester

Electronic_ISBN

978-1-84919-815-8

Type

conf

DOI

10.1049/cp.2014.0372

Filename

6836797