Title :
A new method for building solder bumps for advanced packaging
Author :
Dishon, Giora J.
Author_Institution :
Microelectron. Center of North Carolina, Research Triangle Park, NC, USA
Abstract :
Summary form only given. The two basic approaches that are currently being used to build solder bumps-wet electroplating and dry evaporation-are subject to strong limitations that prevent a wider application throughout the electronics industry. These limitations are nonuniformities and impurities for the electroplating process, and large investments for process development and production implementation for the evaporation-through-metal-mask process. At MCNC, a method of building small-size (d approximately 1 mil) solder bumps is being developed. The process utilizes conventional thin-film equipment and processes, and soldering equipment and processes. High-yield solder-bumped wafers and/or substrates can be obtained. The process outline and results are presented.<>
Keywords :
packaging; soldering; MCNC; advanced packaging; electronics industry; impurities; nonuniformities; process development; production implementation; solder bumps; thin-film equipment; yield; Capacitance; Connectors; Electric resistance; Electronics industry; Impurities; Inductance; Investments; Microelectronics; Packaging; Production;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 1988, Design-to-Manufacturing Transfer Cycle. Fifth IEEE/CHMT International
Conference_Location :
Lake Buena Vista, FL, USA
DOI :
10.1109/EMTS.1988.16160
