DocumentCode :
1590233
Title :
Consideration of age degradation in the RF performance of CMOS radio chips for high volume manufacturing
Author :
Ruberto, Mark ; Maimon, Tzvi ; Shemesh, Yair ; Desormeaux, A.B. ; Zhang, Weiquan ; Yeh, Chune-Sin
Author_Institution :
Wireless Products Div., Intel Israel Design Center, Haifa, Israel
fYear :
2005
Firstpage :
549
Lastpage :
552
Abstract :
The age reliability of the RF performance of CMOS radio chips must be validated prior to high volume manufacturing. In this paper, we show the results of age simulations on some RF subblock designs used in our 802.11 a/b/g radio chip transceiver for our WLAN card. Transistor age models, based on HCI and NBTI age degradation mechanisms, were derived from stress measurements made on a variety of NMOS and PMOS transistors. They were used in full circuit level age simulations on a driver amplifier and a mixer design, presented here, using Cadence´s RelXpert simulator, which allows for age modeling from the single transistor level up to the entire TX and RX chain hierarchies.
Keywords :
CMOS analogue integrated circuits; circuit simulation; integrated circuit modelling; integrated circuit reliability; mixers (circuits); power amplifiers; radiofrequency integrated circuits; semiconductor device models; transceivers; wireless LAN; HCI degradation mechanisms; IEEE 802.11 a/b/g; NBTI degradation mechanisms; NMOS transistor stress measurements; PMOS transistors; RF CMOS transceiver chips; RF performance age degradation; RFIC; WLAN card; age device modeling; age simulations; driver amplifier; high volume manufacturing; mixer; radio chip age reliability; reliability simulator; transistor age models; Circuit simulation; Degradation; Human computer interaction; Manufacturing; Niobium compounds; Radio frequency; Semiconductor device modeling; Titanium compounds; Transceivers; Wireless LAN;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Radio Frequency integrated Circuits (RFIC) Symposium, 2005. Digest of Papers. 2005 IEEE
ISSN :
1529-2517
Print_ISBN :
0-7803-8983-2
Type :
conf
DOI :
10.1109/RFIC.2005.1489872
Filename :
1489872
Link To Document :
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