DocumentCode
1590443
Title
Temperature controlled multi-oven for MTF tests
Author
Ciofi, C. ; Giannetti, R. ; Neri, B.
Author_Institution
Pisa Univ., Italy
Volume
2
fYear
1998
Firstpage
1282
Abstract
The design and principle of operation of a measurement system primarily intended for performing MTF (median time to failure) tests on metallic interconnections of integrated circuit is presented. The instrument is different from other similar equipment in that a separate heating system is used for each sample. This approach will allow one, probably for the first time, to perform such tests in the ideal conditions of constant current and temperature for all the samples
Keywords
failure analysis; integrated circuit metallisation; integrated circuit reliability; integrated circuit testing; life testing; ovens; MTF tests; measurement system; median time to failure tests; metallic IC interconnections; separate heating system; temperature controlled multi-oven; Circuit testing; Heating; Instruments; Integrated circuit interconnections; Integrated circuit measurements; Integrated circuit testing; Performance evaluation; System testing; Temperature control; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Instrumentation and Measurement Technology Conference, 1998. IMTC/98. Conference Proceedings. IEEE
Conference_Location
St. Paul, MN
ISSN
1091-5281
Print_ISBN
0-7803-4797-8
Type
conf
DOI
10.1109/IMTC.1998.676933
Filename
676933
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