DocumentCode :
1590715
Title :
Shadow Stack Scratch-Pad-Memory for Low Power SoC
Author :
Ming, Ling ; Xianqiang, Shi ; Yu, Zhang
Author_Institution :
Nat. ASIC Syst. Eng. Technol. Res. Center, Southeast Univ., Nanjing
fYear :
2008
Firstpage :
394
Lastpage :
401
Abstract :
In many embedded system, researches focus on how to use on-chip memory, like SPM, to reduce the energy consumption generated by off-chip memory, such as SDRAM or DRAM. They put the often use instructions and important data into on-chip memory to reduce the power because off-chip memory consumes a large of energy than on-chip memory. However, stack is a key factor that impacts the power consumption, since when function is called, the passing parameter, local variables and temporary data will use stack. We organize a shadow stack scratch-pad memory which operation behavior is somewhat like Cache, to store the stack data to reduce the stack access of off-chip memory. This memory architecture is called S3PM. The S3PM has two segments to remap the off-chip memory, leading CPU to access the S3PM when the access address is in the range of remapped area byS3PM. The paper proposes a novel memory subsystem architecture which constituted by the off-chip SDRAM, on-chip S3PM and traditional SPM. The S3PM is used to remap the stack off-chip memory which address is accessed high frequently while traditional SPM is used to store instruction and data. The results shows that the S3PM can reduce many energy but using a little size of on-chip memory.
Keywords :
embedded systems; memory architecture; system-on-chip; embedded system; energy consumption; low power SoC; memory subsystem architecture; onchip memory; shadow stack scratch-pad memory; shadow stack scratch-pad-memory; stack data; stack off-chip memory; Application software; Cost function; Embedded computing; Embedded system; Energy consumption; Memory architecture; Power system management; SDRAM; Scanning probe microscopy; System-on-a-chip; Energy; S3PM; SDRAM; SPM; Stack;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Embedded Computing, 2008. SEC '08. Fifth IEEE International Symposium on
Conference_Location :
Beijing
Print_ISBN :
978-0-7695-3348-3
Type :
conf
DOI :
10.1109/SEC.2008.74
Filename :
4690781
Link To Document :
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