DocumentCode
1591172
Title
Metal-gate work-function fluctuation in 16-nm single- and multi-fin field effect transistors with different aspect ratio
Author
Cheng, Hui-Wen ; Li, Yiming
Author_Institution
Dept. of Electr. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
fYear
2010
Firstpage
48
Lastpage
51
Abstract
The work-function fluctuation (WKF) in 16-nm single- and triple-fin field effect transistors (FETs) with different aspect ratio (AR) of device geometry is for the first time explored. The influences of grain size of metal gate and AR on σIoff/σIon are drawn; the device with high AR and large number of silicon fin can suppress the WKF. The triple-fin FinFET (AR = 2) is superior to triple-fin tri-gate (AR = 1) and quasi-planar (AR = 0.5) structures, where gate materials TiN and MoN are considered in n- and p-typed FETs. Compared with nFET, the WKF of pFET is larger than that of n-typed device due to the gate material having wider work-function variation. The 3D device simulation study on WKF-induced σIoff/ σIon benefits fabrication of nulti-fin devices.
Keywords
field effect transistors; aspect ratio; device geometry; metal-gate work-function fluctuation; multifin field effect transistors; n-typed FET; p-typed FET; quasi-planar structures; single fin field effect transistors; triple-fin field effect transistors; triple-fin tri-gate; Doping; FETs; FinFETs; Fluctuations; Grain size; Inorganic materials; MOSFETs; Shape; Silicon; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Electronics (ICSE), 2010 IEEE International Conference on
Conference_Location
Melaka
Print_ISBN
978-1-4244-6608-5
Type
conf
DOI
10.1109/SMELEC.2010.5549472
Filename
5549472
Link To Document