• DocumentCode
    1591172
  • Title

    Metal-gate work-function fluctuation in 16-nm single- and multi-fin field effect transistors with different aspect ratio

  • Author

    Cheng, Hui-Wen ; Li, Yiming

  • Author_Institution
    Dept. of Electr. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
  • fYear
    2010
  • Firstpage
    48
  • Lastpage
    51
  • Abstract
    The work-function fluctuation (WKF) in 16-nm single- and triple-fin field effect transistors (FETs) with different aspect ratio (AR) of device geometry is for the first time explored. The influences of grain size of metal gate and AR on σIoff/σIon are drawn; the device with high AR and large number of silicon fin can suppress the WKF. The triple-fin FinFET (AR = 2) is superior to triple-fin tri-gate (AR = 1) and quasi-planar (AR = 0.5) structures, where gate materials TiN and MoN are considered in n- and p-typed FETs. Compared with nFET, the WKF of pFET is larger than that of n-typed device due to the gate material having wider work-function variation. The 3D device simulation study on WKF-induced σIoff/ σIon benefits fabrication of nulti-fin devices.
  • Keywords
    field effect transistors; aspect ratio; device geometry; metal-gate work-function fluctuation; multifin field effect transistors; n-typed FET; p-typed FET; quasi-planar structures; single fin field effect transistors; triple-fin field effect transistors; triple-fin tri-gate; Doping; FETs; FinFETs; Fluctuations; Grain size; Inorganic materials; MOSFETs; Shape; Silicon; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Electronics (ICSE), 2010 IEEE International Conference on
  • Conference_Location
    Melaka
  • Print_ISBN
    978-1-4244-6608-5
  • Type

    conf

  • DOI
    10.1109/SMELEC.2010.5549472
  • Filename
    5549472