DocumentCode :
1591172
Title :
Metal-gate work-function fluctuation in 16-nm single- and multi-fin field effect transistors with different aspect ratio
Author :
Cheng, Hui-Wen ; Li, Yiming
Author_Institution :
Dept. of Electr. Eng., Nat. Chiao-Tung Univ., Hsinchu, Taiwan
fYear :
2010
Firstpage :
48
Lastpage :
51
Abstract :
The work-function fluctuation (WKF) in 16-nm single- and triple-fin field effect transistors (FETs) with different aspect ratio (AR) of device geometry is for the first time explored. The influences of grain size of metal gate and AR on σIoff/σIon are drawn; the device with high AR and large number of silicon fin can suppress the WKF. The triple-fin FinFET (AR = 2) is superior to triple-fin tri-gate (AR = 1) and quasi-planar (AR = 0.5) structures, where gate materials TiN and MoN are considered in n- and p-typed FETs. Compared with nFET, the WKF of pFET is larger than that of n-typed device due to the gate material having wider work-function variation. The 3D device simulation study on WKF-induced σIoff/ σIon benefits fabrication of nulti-fin devices.
Keywords :
field effect transistors; aspect ratio; device geometry; metal-gate work-function fluctuation; multifin field effect transistors; n-typed FET; p-typed FET; quasi-planar structures; single fin field effect transistors; triple-fin field effect transistors; triple-fin tri-gate; Doping; FETs; FinFETs; Fluctuations; Grain size; Inorganic materials; MOSFETs; Shape; Silicon; Tin;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Electronics (ICSE), 2010 IEEE International Conference on
Conference_Location :
Melaka
Print_ISBN :
978-1-4244-6608-5
Type :
conf
DOI :
10.1109/SMELEC.2010.5549472
Filename :
5549472
Link To Document :
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