DocumentCode
159123
Title
An experimental evaluation of thermally conductive filler loaded encapsulant composites
Author
Hewitt, D.A. ; Stone, David A. ; Foster, Martin P.
Author_Institution
Dept. of Electron. & Electr. Eng., Univ. of Sheffield, Sheffield, UK
fYear
2014
fDate
8-10 April 2014
Firstpage
1
Lastpage
6
Abstract
In this paper, epoxy/aluminium oxide powder composites designed for use as encapsulants are produced and thermally characterised. Experimental results obtained for a variety of filler concentrations, sample thicknesses and manufacturing methods are presented and compared to analytical and empirical models from literature. Further to this the effects of modifying analytical models using experimental data are considered. This yields models which allow the bulk thermal conductivity of these composites to be predicted more accurately than when the models were used in a purely analytical manner. Furthermore, the effect on thermal conductivity of uneven filler distribution within the samples is considered.
Keywords
composite materials; encapsulation; powders; thermal conductivity; bulk thermal conductivity; epoxy-aluminium oxide powder composite; manufacturing method; thermally conductive filler loaded encapsulant composite; Composites; Potting Compound; Thermal Epoxy; Thermal Modelling;
fLanguage
English
Publisher
iet
Conference_Titel
Power Electronics, Machines and Drives (PEMD 2014), 7th IET International Conference on
Conference_Location
Manchester
Electronic_ISBN
978-1-84919-815-8
Type
conf
DOI
10.1049/cp.2014.0403
Filename
6836901
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