• DocumentCode
    159123
  • Title

    An experimental evaluation of thermally conductive filler loaded encapsulant composites

  • Author

    Hewitt, D.A. ; Stone, David A. ; Foster, Martin P.

  • Author_Institution
    Dept. of Electron. & Electr. Eng., Univ. of Sheffield, Sheffield, UK
  • fYear
    2014
  • fDate
    8-10 April 2014
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    In this paper, epoxy/aluminium oxide powder composites designed for use as encapsulants are produced and thermally characterised. Experimental results obtained for a variety of filler concentrations, sample thicknesses and manufacturing methods are presented and compared to analytical and empirical models from literature. Further to this the effects of modifying analytical models using experimental data are considered. This yields models which allow the bulk thermal conductivity of these composites to be predicted more accurately than when the models were used in a purely analytical manner. Furthermore, the effect on thermal conductivity of uneven filler distribution within the samples is considered.
  • Keywords
    composite materials; encapsulation; powders; thermal conductivity; bulk thermal conductivity; epoxy-aluminium oxide powder composite; manufacturing method; thermally conductive filler loaded encapsulant composite; Composites; Potting Compound; Thermal Epoxy; Thermal Modelling;
  • fLanguage
    English
  • Publisher
    iet
  • Conference_Titel
    Power Electronics, Machines and Drives (PEMD 2014), 7th IET International Conference on
  • Conference_Location
    Manchester
  • Electronic_ISBN
    978-1-84919-815-8
  • Type

    conf

  • DOI
    10.1049/cp.2014.0403
  • Filename
    6836901