DocumentCode
1592309
Title
SIMOX and VLSI high speed and rad hard applications: discussion of floating body effects and circuits optimization
Author
Auberton, A.J.
Author_Institution
CEA-IRDI-D LETI, CENG, Grenoble, France
fYear
1988
Firstpage
55
Abstract
Some results obtained in a CMOS prototype line environment are reported to show the compatibility of SIMOX (separation by implantation of oxygen) technology with industrial applications. The main parameters of devices and circuits optimization are analyzed in terms of VLSI applications. New floating-body effects and solutions to improve the SOI performances are discussed. High-speed and radiation-hard technologies are examined
Keywords
CMOS integrated circuits; VLSI; integrated circuit technology; ion implantation; radiation hardening (electronics); semiconductor-insulator boundaries; CMOS; SIMOX CMOS technology; SOI performances; Si-SiO2-Si; VLSI high speed; circuits optimization; compatibility of SIMOX; floating body effects; industrial applications; prototype line environment; rad hard applications; radiation-hard technologies; separation by implantation of oxygen; Circuits; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
SOS/SOI Technology Workshop, 1988. Proceedings., 1988 IEEE
Conference_Location
St. Simons Island, GA
Type
conf
DOI
10.1109/SOI.1988.95427
Filename
95427
Link To Document