Title :
Fast conformal FDTD-PIC simulation in metal RF structures with accurate Ohmic surface loss
Author :
Cooke, Simon J. ; Stantchev, George M. ; Antonsen, Thomas M.
Author_Institution :
Naval Res. Lab., Washington, DC, USA
Abstract :
Summary form only given. Electromagnetic FDTD-PIC simulation has seen significant advances recently: the availability of highly parallel GPU computing hardware has enabled high performance PIC simulation, while new algorithms for conformal boundary representation provide accurate simulation results in curved surface geometries. Here we combine these techniques to perform fast PIC simulations in complex metal RF structures, with a new algorithm for conformal boundary representation that includes the effects of Ohmic surface loss. Ohmic loss is a critical factor for accelerator and vacuum electronics applications in determining performance characteristics; however in simulations it is particularly sensitive to the accuracy of the boundary representation. Furthermore it is a dispersive effect that presents additional challenges in a time-domain simulation. The algorithm presented represents both the dispersive and dissipative electromagnetic properties of complex metal device structures, while maintaining compatibility with conventional particle simulation methods. We present results of GPUbased Conformal FDTD-PIC simulations, including Ohmic surface losses, which demonstrate second-order convergence of both frequency and Q. Examples of vacuum electronic device simulation will be used to show the utility of the code as a practical tool for rapid 3D device simulation and design, with a unique combination of speed and accuracy.
Keywords :
finite difference time-domain analysis; plasma simulation; conformal boundary representation; fast conformal FDTD-PIC simulation; metal RF structure; ohmic surface loss; Accuracy; Computational modeling; Electromagnetics; Metals; Radio frequency; Solid modeling; Three-dimensional displays;
Conference_Titel :
Plasma Science (ICOPS), 2013 Abstracts IEEE International Conference on
Conference_Location :
San Francisco, CA
DOI :
10.1109/PLASMA.2013.6634849