Title :
A cost effective method to analyze wafer edge structure in high volume manufacturing for 200mm wafer fabs
Author :
bin Ahmataku, Handie ; Kipli, Kuryati
Author_Institution :
X-FAB Sarawak Sdn. Bhd., Kuching, Malaysia
Abstract :
Significant financial profits recognized by reducing the wafer edge exclusion ring in order to increase extra productive dies as well as enhance the yield of the edge-most region of the semiconductor wafer. A method to determine distance of structure from a wafer edge is implemented using software called HandiExclusion v.3 and template named HandieRad. The wafer is put onto the template to get H degree measurement. Program then convert the H degree to a distance measurement from the wafer edge. Scanning Electron Microscope (SEM) Tap-Center Technique used to move precisely at the target distance.
Keywords :
distance measurement; integrated circuit measurement; integrated circuit yield; scanning electron microscopes; H degree measurement; HandiExclusion v.3; HandieRad; cost effective method; distance measurement; high volume manufacturing; scanning electron microscope tap-center technique; semiconductor wafer; size 200 mm; wafer edge exclusion ring; wafer edge structure; wafer fabs; Costs; Cutting tools; Manufacturing; Monitoring; Numerical analysis; Optical microscopy; Pollution measurement; Scanning electron microscopy; Shape measurement; Testing;
Conference_Titel :
Semiconductor Electronics (ICSE), 2010 IEEE International Conference on
Conference_Location :
Melaka
Print_ISBN :
978-1-4244-6608-5
DOI :
10.1109/SMELEC.2010.5549538
