• DocumentCode
    1593384
  • Title

    Landscape of Combinatorial Materials Exploration and High Throughput Characterizations for the Post-CMOS Devices

  • Author

    Chikyow, T. ; Ohmori, K. ; Nagata, T. ; Umezawa, N. ; Haemori, M. ; Yoshitake, Masahiro ; Hasegawa, T. ; Koinuma, H. ; Yamada, K.

  • Author_Institution
    Nat. Inst. for Mater. Sci., Tsukuba
  • fYear
    2008
  • Firstpage
    66
  • Lastpage
    67
  • Abstract
    A combinatorial synthesis and high throughput characterization was employed to accelerate the new materials exploration. Also tow basic guide lines were shown to design the future nano CMOS. They are amorphous structure and defect control. As examples, we examined a HfO2-Y2O3-Al2O3 ternary oxide for gate oxide and Pt-W, Ru-Mo amorphous metals for metal gate. Moreover, C-incorporation is effective to obtain metal electrodes with a smaller grain size, which would be required for ultimate short-channel MIS-FET devices in 32-22 nm node and beyond to suppress variability of electric properties as well.
  • Keywords
    CMOS integrated circuits; aluminium compounds; amorphous semiconductors; hafnium compounds; nanoelectronics; yttrium compounds; C-incorporation; HfO2-Y2O3-Al2O3; Pt-W; Ru-Mo; amorphous metals; amorphous structure; combinatorial materials exploration; combinatorial synthesis; defect control; electric properties; gate oxide; grain size; metal electrodes; metal gate; nano CMOS; post-CMOS devices; size 32 nm to 22 nm; ternary oxide; ultimate short-channel MIS-FET devices; Alloying; Dielectric constant; Dielectric materials; Fluctuations; High K dielectric materials; Inorganic materials; Large scale integration; Optical materials; Probes; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems and Applications, 2008. VLSI-TSA 2008. International Symposium on
  • Conference_Location
    Hsinchu
  • ISSN
    1524-766X
  • Print_ISBN
    978-1-4244-1614-1
  • Electronic_ISBN
    1524-766X
  • Type

    conf

  • DOI
    10.1109/VTSA.2008.4530801
  • Filename
    4530801