• DocumentCode
    1593531
  • Title

    A New Multi-Site Probe Array with Monolithically Integrated Parylene Flexible Cable for Neural Prostheses

  • Author

    Pang, Changlin ; Cham, Jorge G. ; Nenadic, Zoran ; Musallam, Sam ; Tai, Yu-Chong ; Burdick, Joel W. ; Andersen, Richard A.

  • Author_Institution
    Caltech Micromachining Lab., California Inst. of Technol., Pasadena, CA
  • fYear
    2005
  • fDate
    6/27/1905 12:00:00 AM
  • Firstpage
    7114
  • Lastpage
    7117
  • Abstract
    This work presents a new multi-site probe array applied with parylene technology, used for neural prostheses to record high-level cognitive neural signals. Instead of inorganic materials (e.g. silicon dioxide, silicon nitride), the electrodes and conduction traces on probes are insulated by parylene, which is a polymer material with high electrical resistivity, mechanical flexibility, biocompatibility and easy deposition process. As a result, the probes exhibit better electrical and mechanical properties. The all dry process is demonstrated to fabricate these probe arrays with monolithically integrated parylene flexible cables using double-side-polished (DSP) wafers. With the parylene flexible cables, the probes can be easily assembled to a high density 3-D array for chronic implantation
  • Keywords
    arrays; bioelectric potentials; biomedical electrodes; cognition; neurophysiology; polymers; prosthetics; all dry process; chronic implantation; conduction traces; double-side-polished wafers; electrical properties; electrodes; high density 3-D array; high-level cognitive neural signals; mechanical properties; monolithically integrated parylene flexible cable; multisite probe array; neural prostheses; polymer; Cables; Dielectrics and electrical insulation; Electrodes; Inorganic materials; Plastic insulation; Polymers; Probes; Prosthetics; Silicon compounds; Silicon on insulator technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2005. IEEE-EMBS 2005. 27th Annual International Conference of the
  • Conference_Location
    Shanghai
  • Print_ISBN
    0-7803-8741-4
  • Type

    conf

  • DOI
    10.1109/IEMBS.2005.1616146
  • Filename
    1616146