Title :
Unipolar Switching Characteristics for Self-Aligned WOx Resistance RAM (R-RAM)
Author :
Chien, Wei-Chih ; Lai, Erh-Kun ; Chang, Kuo-Pin ; Yeh, Chien-Hung ; Hsueh, Ming-Hsiang ; Yao, Yeong-Der ; Luoh, Tuung ; Hsieh, Sheng-Hui ; Yang, T.H. ; Chen, K.C. ; Chen, Yi-Chou ; Hsieh, Kuang-Yeu ; Liu, Rich ; Lu, Chih-Yuan
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu
Abstract :
For the first time a unipolar resistance memory with good performance and reliability is demonstrated. A short (20-50 ns) positive pulse switches the WOx film from low resistance state (LRS) to high resistance state (HRS), while a longer (200-500 ns) positive pulse switches the film from HRS to LRS. Negative pulses, on the other hand, do not produce reversible resistivity changes. Despite the low energy switching, both LRS and HRS are very stable, capable of withstanding 2,500 hours of baking at up to 150 degC- Furthermore, the WOx R-RAM can withstand > 1,000 cycles of LRS/HRS switching, and the device is also highly immune to read disturb. This unipolar device is promising for future 3D high-density NVM storage.
Keywords :
electrical resistivity; random-access storage; thin film devices; tungsten compounds; 3D high-density NVM storage; film; high resistance state; low resistance state; reversible resistivity; self-aligned resistance RAM; temperature 150 degC; time 2500 hour; unipolar resistance memory; unipolar switching; Conductivity; Materials reliability; Materials science and technology; Nonvolatile memory; Oxidation; Physics; Read-write memory; Reliability engineering; Switches; Voltage;
Conference_Titel :
VLSI Technology, Systems and Applications, 2008. VLSI-TSA 2008. International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4244-1614-1
Electronic_ISBN :
1524-766X
DOI :
10.1109/VTSA.2008.4530838