DocumentCode :
159458
Title :
Estimating the effect of single-event upsets on microprocessors
Author :
Constantinescu, C. ; Krishnamoorthy, Sriram ; Tuyen Nguyen
Author_Institution :
Adv. Micro Devices, Inc., Fort Collins, CO, USA
fYear :
2014
fDate :
1-3 Oct. 2014
Firstpage :
185
Lastpage :
190
Abstract :
Evaluating the impact of single-event upsets (SEUs) on complex VLSI circuits in general, and microprocessors in particular, requires an interdisciplinary approach, that includes soft error modeling, accelerated measurements, derating of the raw error rates, and specialized design tools. This paper discusses modeling techniques employed to estimate the soft error rates (SER) of storage cells, provides results of accelerated measurements for three technology nodes, and presents a technique for derating the raw error rates by simulated error injection. We use the measurement results to validate and calibrate the models. Then present the tool employed for deriving the SER of the Advanced Micro Devices processor code-named “Bulldozer” and examples of estimated SER. Our approach enables the cost-effective mitigation of SEU by employing data integrity protection for the most sensitive logic.
Keywords :
VLSI; data integrity; data protection; microprocessor chips; radiation hardening (electronics); Bulldozer; SER; SEU; accelerated measurements; advanced microdevices processor code; complex VLSI circuits; cost-effective mitigation; data integrity protection; interdisciplinary approach; microprocessors; raw error rates; single-event upsets; soft error modeling; specialized design tools; storage cells; technology nodes; Acceleration; Computational modeling; Design automation; Integrated circuit modeling; Mathematical model; Microprocessors; Solid modeling; microprocessors; single-event upsets; soft errors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Defect and Fault Tolerance in VLSI and Nanotechnology Systems (DFT), 2014 IEEE International Symposium on
Conference_Location :
Amsterdam
Print_ISBN :
978-1-4799-6154-2
Type :
conf
DOI :
10.1109/DFT.2014.6962059
Filename :
6962059
Link To Document :
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