Title :
A multi-layer plastic packaging technology for miniaturized bio analysis systems containing integrated electrical and mechanical functionality
Author :
Han, Arum ; Wang, Ohia ; Mohanty, Swomitra K. ; Graff, Mason ; Frazier, A. Bruno
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
6/24/1905 12:00:00 AM
Abstract :
A multi-layer plastic packaging technology has been developed for microfluidic systems containing electrical and mechanical functionality. Hot embossing and heat staking of plastics, micro stenciling of electrodes, and stereolithography was combined with conventional MEMS fabrication techniques to realize the system. The approach allows for multiple materials of fabrication, provides a solution to integration of electrical functionality throughout the system, and provides an interconnect technology for interfacing fluids and electrical components between the macro and the micro worlds
Keywords :
biosensors; electroforming; microelectrodes; microfluidics; microsensors; moulding; plastic packaging; rapid prototyping (industrial); MEMS fabrication; biochemical analysis systems; biocompatible sheets; bond strength; electrical functionality; electrodes; electroformed molds; fine line metallization; fluidic inlets; fluidic outlets; heat staking; hot embossing; inner layer vias; integrated functionality; integrated ports; interconnect technology; mechanical functionality; micro stenciling; microfluidic systems; miniaturized bio analysis systems; multilayer plastic packaging technology; plastic bonding; polyethylene; polymethyl methacrylate; stereolithography; total analysis system; Bonding; Electrodes; Embossing; Fabrication; Microfluidics; Pharmaceutical technology; Plastic packaging; Polyethylene; Stereolithography; USA Councils;
Conference_Titel :
Microtechnologies in Medicine & Biology 2nd Annual International IEEE-EMB Special Topic Conference on
Conference_Location :
Madison, WI
Print_ISBN :
0-7803-7480-0
DOI :
10.1109/MMB.2002.1002266
