• DocumentCode
    1596094
  • Title

    3D particle in cell simulations of spark gap discharge using Argon gas as dielectric medium

  • Author

    Reddy, C. Shreedhar ; Tewari, Somesh Vinayak ; Sharma, Ashok ; Mittal, Kailash Chandra ; Umbarkar, Sachin B.

  • Author_Institution
    Bhabha Atomic Res. Centre, Mumbai, India
  • fYear
    2013
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given. This paper presents PIC simulations of spark gap discharge, filled with Argon gas at atmospheric pressure. The rogowsky profile electrodes having an inter-electrode gap distance of 20mm were used in this study. The model is based on explosive electron emission from cathode, secondary emission and neutral Argon gas ionization. The phase space profiles, current density, ionization, temperature and velocity of electron plots are presented. Results show that some simulations are in good agreement with existing experimental data. The simulation data of argon discharge was also compared with our previous work of nitrogen gas discharge1. The difference between the two gases for using them as a dielectric medium in spark gaps is presented.
  • Keywords
    argon; cathodes; discharges (electric); electron density; explosions; ionisation; plasma density; plasma simulation; plasma temperature; plasma transport processes; secondary electron emission; spark gaps; 3D particle-in-cell simulation; Ar; Srogowsky profile electrode; cathode; dielectric medium; distance 20 mm; electron current density; electron ionization; electron phase space profile; electron temperature; electron velocity; explosive secondary electron emission; gas discharge; interelectrode gap distance; neutral gas ionization; pressure 1 atm; spark gap discharge; Argon; Atmospheric modeling; Dielectrics; Discharges (electric); Semiconductor process modeling; Solid modeling; Sparks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science (ICOPS), 2013 Abstracts IEEE International Conference on
  • Conference_Location
    San Francisco, CA
  • ISSN
    0730-9244
  • Type

    conf

  • DOI
    10.1109/PLASMA.2013.6634977
  • Filename
    6634977